The heat-free alloy materials developed by the group have realized the substitution of "aluminum instead of steel" materials for new energy vehicle structural parts with integration, large size, thin wall, complex structure and easy deformation after heat treatment, broken the foreign product monopoly and technical blockade in this field, and realized the localization of heat-free high-performance materials. While reducing the production cost and heat treatment cost of aluminum castings, it will play a vital role in promoting vehicle lightweight, energy conservation and emission reduction, increasing the endurance capacity of new energy vehicles and improving vehicle safety.

The high thermal conductivity die-casting aluminum alloy developed by the group adopts proprietary purification technology to replace refined aluminum raw materials, which greatly reduces the material cost of the alloy. The alloy has the advantages of high thermal conductivity, high conductivity and low coefficient of linear expansion. Its performance indexes are much higher than the advanced level of EU and industry. Good mechanical properties, die casting performance, machining performance and corrosion resistance. It is more suitable for structural parts with high requirements for heat conduction and conductivity, such as 5g communication, consumer electronics and other fields.

The standard sample for spectral analysis of aluminum alloy developed by the group through semi continuous casting process has passed the appraisal of the National Standards Committee. The successful development of various brands of aluminum alloy spectral analysis standard samples marks the advanced level of industry technology of Lizhong alloy group.

The silicon aluminum alloy developed and produced by the group has the characteristics of high thermal conductivity and low density, and has good thermal expansion matching with chip materials. It is widely used in electronic systems and high-power integrated circuit packaging for aerospace vehicles. The weight of our silicon aluminum alloy is only 1 / 3 of that of traditional materials, which can meet the requirements of continuous miniaturization, high integration and lightweight of electronic devices, and has thermal expansion and effective heat dissipation performance matching with the chip, so as to improve the service life of the chip. It is the preferred material for aerospace electronic systems and large-scale integrated circuits.